Conductive Copper Adhesive

Product Name Conductive Copper Adhesive Product Overview This product is a high-performance thermosetting conductive copper adhesive, refined with high-purity conductive copper powder as functional filler, modified high-temperature resistant resin system and special additives. It is a composite electronic adhesive with both high-strength bonding performance and excellent conductivity. With a stable curing process, it can be cured at a constant temperature of 150~250°C for 20 minutes, suitable for rapid industrial mass production. Featuring moderate viscosity and excellent rheological properties, the adhesive supports various construction processes. The original adhesive can be directly used for screen printing, dispensing and manual coating, and can be sprayed after dilution with special diluent. Characterized by electroplatable and non-solderable, the cured adhesive layer is dense, uniform, high-adhesive and stable in conductivity. Specially designed for conductive bonding and fixed interconnection of various electronic devices, it is widely applicable to the fitting, fixing and conductive connection processes of electronic components. Technical Parameter •Curing Condition: Constant temperature curing at 150~250°C for 20 minutes •Viscosity Characteristic: Moderate viscosity with controllable rheology for multi-process construction •Construction Method: Screen printing recommended; compatible with dispensing and direct coating, sprayable after dilution •Process Attribute: Electroplatable, non-solderable •Core Application: Conductive bonding, fixing and conductive interconnection of various electronic devices Product Features •Multi-process compatibility & strong construction versatility: With excellent viscosity adaptability, the adhesive covers mainstream electronic manufacturing processes. It can realize large-area uniform coating via screen printing, precision point bonding through automatic dispensing equipment, and small-batch rework and sample production via manual coating. It can also be sprayed after dilution, fully adapting to different production scenarios and accuracy requirements. •Wide-temperature fast curing & high mass production efficiency: It features a wide curing temperature range of 150~250°C and completes curing within 20 minutes with uniform and stable curing speed. No incomplete local curing or adhesive layer cracking occurs, balancing production efficiency and product yield, suitable for large-scale mass production on automatic assembly lines. •Electroplatable modification & strong scalability: Modified with a special formula, the cured adhesive layer can be directly electroplated with excellent coating adhesion and no peeling, which effectively improves the surface conductivity, corrosion resistance and appearance texture of devices, meeting the subsequent surface treatment requirements of high-end electronic devices. •Non-solderable feature & accurate process compatibility: The cured product cannot be soldered, which accurately avoids process problems such as welding crosstalk, false welding and poor solder wettability. It is suitable for device processes requiring only bonding and conduction without welding, preventing damage to precision devices caused by high welding temperature. •Excellent bonding and conductive performance: The cured adhesive layer integrates high-strength bonding and stable conductivity with dense and pore-free structure, low and long-term stable contact resistance. It features good humidity-heat resistance, aging resistance and vibration resistance, which can firmly bond various electronic devices and ensure long-term reliable conductive interconnection. •Superior paste stability: The product has good storage stability with no sedimentation or caking. It maintains uniform fluidity without adhesive breakage or overflow during construction, ensuring high consistency in mass production and reducing defective rates effectively. Application Fields Focusing on conductive bonding and fixed interconnection of electronic devices, this product is widely used in various precision electronic fields relying on the core advantages of electroplatable performance, multi-process construction, high-strength bonding and stable conductivity. It is mainly applied to conductive bonding and fixing of various electronic components, fitting interconnection of precision devices, reinforcement and fixing of circuit board components, conductive connection of sensor devices, fitting and bonding of small modules, and conductive fixing of hardware electronic accessories. It is especially suitable for the manufacturing of electronic products requiring subsequent electroplating treatment, prohibiting soldering processes, and relying solely on adhesive bonding for conduction, meeting the production needs of device bonding and conductive interconnection in consumer electronics, smart home, industrial control electronics, communication equipment, small precision modules and other fields. User Guide •Storage Environment: Store the fully sealed product in a cool, dry, clean and ventilated constant temperature indoor environment at a standard temperature of 5-25°C. Keep away from fire sources, heat sources, strong acids, strong alkalis, organic solvents and other corrosive and flammable substances, and avoid direct sunlight, high-temperature exposure and low-temperature freezing. •Storage Requirements: Keep unopened products fully sealed and never expose to open air to prevent moisture absorption, oxidation, drying and deterioration of the adhesive. Tighten the sealing cover immediately after each use to isolate air and moisture and avoid viscosity change and performance attenuation. Slight stratification during storage is a normal physical phenomenon, and the product can be used normally after full stirring without affecting performance. •Shelf Life: 6 months under standard sealed room temperature storage conditions. It is recommended to use up within 1 month after opening to ensure stable bonding strength, conductivity and electroplating adaptability. •Usage Prohibition: This product is non-solderable and shall not be used in processes requiring soldering. It is electroplatable and compatible with conventional electroplating processes, but do not mix with conductive adhesives or diluents of other brands to avoid damaging the rheology, bonding and electroplating performance of the adhesive.