Low-Temperature Electrode Copper Paste

Product Name Low-Temperature Electrode Copper Paste Product Overview This product is a high-performance low-temperature curing electrode copper paste. It is a functional conductive paste refined with high-purity copper powder as conductive filler, special polymer resin as matrix and functional additives. With a wide curing temperature range, it can be fully cured at 60-200°C with a standard curing time of 20 minutes. The paste has excellent system stability and is compatible with various coating processes. The cured coating features strong adhesion, stable conductivity and superior mechanical properties, which can form uniform and dense conductive electrode circuits on various flexible and rigid substrates. It is a versatile and universal conductive electrode material. Technical Parameter 使用方法 250-350 mesh stainless screen Method of use 250-350 目丝网印刷 流平 Leveling 3-5min minutes at room temperature 室温下流平 3-5 分钟(时间根据流平的实际情况决定) 固化 在恒温烘箱,或者持续热风(以下条件选其一即可) Curing conditions 80°C 60 分钟/mins 120°C 20 分钟/mins 150°C 15 分钟/mins Fineness 细度 ≤8μm FOG test Viscosity 粘度 80-220Pa.s 粘度可根据用户实际需要调节。 固体含量 content 65-80% 铜 Copper,Glue 方阻 Resistivity ≤200mΩ/□ 方阻测试法 固化膜厚10μm,测试图形100mm*1mm Cured film thickness 10-25μm,test pattern 100mm * 1mm ≤100mΩ/□ 四针探测法 25.4u Four-needle probe 25.4u 附着力 无脱落 3M 600#胶带90°拉 Adhesion Not fall off 3M 600#Tape 90°Pull Product Features • Wide low-temperature curing & strong compatibility: It supports curing starting from 60°C up to 200°C, and completes curing within 20 minutes. Compared with traditional high-temperature copper paste, it features lower energy consumption and higher processing efficiency. It is compatible with various temperature-sensitive substrates such as PET, PI, PVC, glass and ceramic, avoiding substrate deformation and aging caused by high temperature. • Multi-process adaptation & flexible construction: It has excellent process compatibility. Screen printing is recommended with good leveling performance, uniform lines and no pinholes or ink breakage. The original paste can be directly coated, and it can be sprayed after dilution with special diluent, meeting the production requirements of different circuit accuracies and construction scenarios. • Superior and stable conductivity: Adopting scientific proportion of high-purity copper powder, the cured coating is dense and uniform with low resistivity and good conductive continuity. It is not easy to oxidize with tiny resistance fluctuation during long-term operation, ensuring stable conductive connection for precision electronic devices. • Excellent adhesion and mechanical properties: With modified resin system, the cured coating has excellent adhesion to substrates, featuring bending resistance, friction resistance and humidity-heat resistance, not easy to fall off or crack, suitable for flexible circuits, outdoor devices and other complex application scenarios. • Excellent paste stability: The paste has no sedimentation or caking with long storage life. It maintains stable fluidity and thixotropy during construction, ensuring high consistency in mass production and reducing defective rate effectively. Application Fields Relying on the core advantages of low-temperature curing, multi-process compatibility and high stability, this product is widely used in the preparation of various medium and low-end precision conductive electrodes and circuits. Main application fields include: conductive circuits and electrodes of flexible printed circuits (FPC), membrane switches, touch sensing devices, smart home sensor electrodes, conductive connection of low-temperature electronic components, conductive circuits on glass and ceramic substrates, electrodes of new energy small devices, RFID radio frequency antennas, conductive coatings of home appliance control panels, etc. It is especially suitable for the manufacturing of temperature-sensitive electronic products that cannot withstand high-temperature processing. User Guide •Storage Environment: Store the sealed product in a cool, dry and ventilated constant temperature environment with the optimal storage temperature of 5-25°C. Keep away from fire sources, heat sources, strong acids, strong alkalis and various organic solvents, and avoid direct sunlight, high-temperature exposure and low-temperature freezing. •Storage Requirements: Keep unopened products fully sealed and never place them open to prevent paste volatilization, moisture absorption and oxidation caking. Tighten the sealing cover immediately after each use to isolate air and moisture. •Shelf Life: The shelf life is 6 months under standard sealed storage conditions. It is recommended to use up the product within 1 month after opening to ensure no attenuation of construction performance and conductivity. •Notes: Slight stratification during storage is a normal physical phenomenon, and the product can be used normally after full stirring without affecting performance. Do not mix with pastes or diluents of other brands.