{"product_id":"high-temperature-sintered-conductive-copper-paste","title":"high-temperature sintered conductive copper paste","description":"\u003cp\u003eProduct Name high-temperature sintered conductive copper paste Product Overview This product is a high-performance high-temperature sintered conductive copper paste, refined from high-purity copper powder as conductive filler, special inorganic binder and dedicated solvent system. It is suitable for circuit printing process on ceramic substrates and cured by high-temperature sintering under nitrogen protection. The formed conductive layer features dense and uniform structure, excellent adhesion and stable conductivity. The finished coating has excellent characteristics of high temperature resistance, solderability and electroplating performance. It is a core conductive material for ceramic-based thick film circuits and high-temperature electronic components, applicable to various high-temperature electronic interconnection scenarios. Technical Parameter •Construction Viscosity: 230Pa·s (standard construction environment) •Construction Method: Screen printing •Curing \u0026amp; Sintering Condition: Nitrogen protection atmosphere, constant temperature at 850°C for 10 minutes •Temperature Resistance After Forming: Long-term operating temperature up to 200°C •Applicable Substrate: Special ceramic substrate •Post-processing Performance: Support electroplating processing and conventional soldering 基材 陶瓷类材料 Substrate Ceramic 印刷 200-300 目丝网印刷 Printing 200-300 mesh stainless screen 流平 5-15min minutes at room temperature Levelling 室温下流平 5-15 分钟(时间根据流平的实际情况决定)。 干燥 通风烘箱烘烤 100-150°C,10-15 分钟 Drying (烘烤温度低于 300°C,可根据烘烤的实际情况决定烘烤时间。) 100-150°C 10-15 min 烧结 隧道炉氮气保护气氛下烧结,峰值 830±10°C(推荐值),10-20 分钟。 Firing Condition (可根据实际需要,烧结范围可在 800-850°C内调节,但峰值温度时间必须至少 10 分钟 一般来说,高温烧结后陶瓷电容性能优于低温烧结) 稀释剂Thinner XFJ252 流平 Leveling 3-5min minutes at room temperature 室温下流平 3-5 分钟(时间根据流平的实际情况决定) 干燥 通风烘箱烘烤 100-150°C,10-15 分钟 Drying (烘烤温度低于 300°C,可根据烘烤的实际情况决定烘烤时间。) 100-150°C 10-15 min 烧结 隧道炉氮气保护气氛下烧结,峰值 830±10°C(推荐值),10-20 分钟。 Firing Condition (可根据实际需要,烧结范围可在 800-850°C内调节,但峰值温度时间必须至少 10 分钟。 一般来说,高温烧结后陶瓷电容性能优于低温烧结) Viscosity 粘度 120-240Pa.s Brookfield HBT utility cup and spindle (SC4-14\/6R),10rpm,25±1°C, Brookfield HBT(博利飞)粘度计, 转子 SC4-14\/6R),10rpm,25±1°C 粘度可根据用户实际需要调节。 固体含量 content 80% Copper 铜 方阻 Resistivity ≤15mΩ\/□ 方阻测试法 固化膜厚 10μm,测试图形 100mm*1mm Cured film thickness 10-25μm,test pattern 100mm * 1mm ≤5mΩ\/□ 四针探测法 25.4u Four-needle probe 25.4u 附着力 无脱落 ≥36.2N Adhesion Not fall off Product Features Excellent high-temperature sintering stability: Adopting exclusive nitrogen-protected sintering process, no oxidation or delamination occurs during curing at 850°C. The conductive layer has high compactness, effectively avoiding high-temperature oxidation failure of copper paste with excellent •product consistency. •Superior constructability: The standard viscosity of 230Pa·s is compatible with conventional screen printing equipment. The paste has balanced fluidity and thixotropy, with clear printed patterns and flat edges without paste overflow or ink breakage, suitable for large-scale mass production. •Comprehensive and balanced performance: The formed coating can withstand long-term high-temperature working condition of 200°C with excellent high-temperature aging resistance. It has good solderability and electroplating adaptability, meeting the secondary processing requirements of subsequent welding assembly and surface electroplating modification. •Special substrate adaptability: The formula is optimized for ceramic substrates with ultra-strong adhesion. No cracking or peeling after sintering, ensuring high reliability and long service life of ceramic-based printed circuits. •Stable conductive performance: The cured copper conductive layer has low resistivity and uniform conductivity, which can meet the conductive interconnection requirements of precision electronic circuits and high-temperature components. Application Fields Developed specifically for ceramic substrate circuit scenarios, this product is widely used in various thick-film electronic devices requiring high temperature resistance, solderability and electroplating performance. Core application scenarios include: ceramic-based printed circuit boards, conductive circuits of high-temperature sensors, electrodes of ceramic electronic components, industrial high-temperature control module circuits, precision thick-film integrated circuits, and high-temperature resistant electronic interconnection terminals. It is applicable to electronic scenarios requiring subsequent soldering, electroplating reinforcement and 200°C high-temperature service, and widely used in industrial electronics, automotive electronics, precision instruments, aerospace supporting electronic components and other fields. User Guide •Storage Environment: Store in a sealed, cool, dry, ventilated and dark place with standard storage temperature of 5°C~25°C. Keep away from high temperature, direct sunlight, humidity, fire sources, heat sources and acid-base corrosive substances. •Storage Requirements: Keep unopened paste sealed and avoid long-term open placement to prevent solvent volatilization, paste crusting and oxidative deterioration. Seal the unused paste after opening, store it under low-temperature refrigeration, and restore it to room temperature and stir thoroughly before construction. •Shelf Life: 6 months for original sealed products stored at room temperature; low-temperature refrigeration can appropriately extend the storage period. Freezing storage is prohibited. •Precautions: Avoid severe vibration and inverted stacking during storage. Check the paste state regularly. Do not use the paste if delamination, agglomeration or abnormal curing occurs.\u003c\/p\u003e","brand":"xfnano","offers":[{"title":"20g solid80%,R≤15mΩ\/□ 110794 \/ Store at 4°C refrigerated \/ 180days","offer_id":57280559513978,"sku":"110794","price":47.66,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0907\/3606\/6938\/files\/1_27871cef-ce01-415a-9a0e-d29d5e516d17.png?v=1780024497","url":"https:\/\/chinanano.com\/products\/high-temperature-sintered-conductive-copper-paste","provider":"xfnano","version":"1.0","type":"link"}