Low-Temperature Hole-Filling Copper Paste

Product Name Low-Temperature Hole-Filling Copper Paste Product Overview This product is a special low-temperature curing hole-filling copper paste, refined from high-purity spherical copper powder, low-temperature curing special resin and professional functional additives, featuring non-flowing and high thixotropy. Developed specifically for the through-hole filling process of upper and lower circuit board vias, it can be fully cured at a constant temperature of 100-200°C for 20 minutes. The paste has excellent moldability; the cured via filling is full, void-free and collapse-free with excellent in-hole conductive continuity, realizing vertical via conduction and interlayer interconnection, and effectively improving the conduction stability and structural flatness of circuit boards. As anon-electroplatable hole-filling material, it requires no subsequent electroplating process with simple procedures, and is suitable for mass production via filling of rigid PCB and ceramic circuit boards. Technical Parameter •Curing Condition: Constant temperature curing at 100-200°C for 20 minutes •Paste Property: Non-flowing & high thixotropy, no sagging and no hole leakage •Construction Method: Special steel mesh printing, suitable for upper and lower through-hole filling of circuit boards •Process Attribute: Non-electroplatable, no electroplating required after curing Product Features Non-flowing & high filling accuracy: With zero fluidity and high thixotropy, the paste avoids •sagging, overflow and hole leakage during printing and filling. It can accurately fill micro through holes with full, flat and void-free cured holes, ensuring high structural accuracy of circuit boards. •Low-temperature curing & wide process window: It cures rapidly within 20 minutes at 100-200°C. The low-temperature process will not damage PCB and ceramic substrates, effectively preventing substrate deformation, cracking and performance degradation caused by high temperature, and meeting mass production requirements of various conventional boards. •Steel mesh printing for dedicated through-hole process: Formulated optimized for upper and lower through-hole filling of circuit boards, it adapts to steel mesh printing with uniform sizing, full hole filling and high molding consistency, suitable for automated mass production lines with high efficiency and low defective rate. •Stable conductivity & high structural reliability: Uniformly proportioned high-purity copper powder forms dense and continuous conductive layers in holes after curing, with stable contact resistance and excellent interlayer conduction. It features good humidity-heat resistance and aging resistance, ensuring long-term service stability. •Electroplating-free process & cost-effective: The non-electroplatable design eliminates supporting electroplating equipment and procedures, simplifies production processes, greatly reduces equipment, material and labor costs, shortens production cycles and adapts to large-scale mass production. •Wide substrate compatibility: Specially adapted to mainstream rigid substrates such as ordinary PCB and ceramic circuit boards. It has strong adhesion to substrates with no peeling or flaking after curing, suitable for the production of various circuit products. Application Fields Dedicated to the conductive filling process of upper and lower through holes of various rigid circuit boards, this product is mainly applicable to ordinary PCB circuit boards and ceramic circuit boards. It is widely used in through-hole filling, interlayer conductive interconnection and through-hole reinforcement of consumer electronic circuit boards, small industrial control circuit boards, smart home control boards, basic communication equipment circuit boards, ceramic-based sensor circuits, and medium and low-power electronic device circuit boards. It is suitable for all low-temperature circuit board hole-filling scenarios without post-electroplating treatment, serving as a professional functional material for low-temperature through-hole conduction and circuit reinforcement. User Guide •Storage Environment: Store the sealed product in a cool, dry, clean and ventilated indoor environment at a standard temperature of 5-25°C. Keep away from fire sources, heat sources, organic solvents and acid-base corrosive substances, and avoid direct sunlight, high-temperature exposure and low-temperature freezing. •Storage Requirements: Keep unopened products fully sealed and never expose to open air to prevent moisture absorption, oxidation and drying. Tighten the seal immediately after each use to isolate air and moisture. Slight static stratification during storage is normal for non-flowing paste, and the product can be used normally after thorough stirring. •Shelf Life: 6 months under standard sealed room temperature storage conditions. It is recommended to use up within 1 month after opening to ensure stable hole-filling effect and conductivity. Usage Prohibition: This product is non-electroplatable and must not be used in processes •requiring subsequent electroplating. Do not mix with other conductive pastes or diluents to avoid damaging the thixotropy and hole-filling performance.