Product Name
Name：Si3N4 nanoparticles
Product Overview
The chemical formula of silicon nitride is Si3N4, which is an artificially synthesized compound composed of Si and N elements, and a strong covalent bond is formed between Si and N elements. Therefore, silicon nitride has excellent comprehensive properties such as mechanical strength, thermal stability, and chemical stability. Silicon nitride can be divided into crystalline and amorphous forms. Amorphous silicon nitride is mainly amorphous, while crystalline silicon nitride is mainly tetragonal, hexagonal, and cubic. Currently, the most extensively studied are hexagonal α - Si3N4, β - Si3N4, and cubic γ - Si3N4. Silicon nitride powder is the raw material for preparing silicon nitride ceramics and is a key factor determining the performance of silicon nitride ceramics. At present, there are many methods to prepare silicon nitride powder, mainly including direct nitridation of silicon powder, carbothermal reduction, sol gel method, self propagating high-temperature synthesis, vapor phase method and microwave synthesis.
Technical Parameter
Size:0-50 nm (SEM)
Appearance：White powder
Purity：~70 wt% (EDS)
Product Features
High hardness and wear resistance: Silicon nitride nanoparticles have extremely high hardness and good wear resistance, which makes them widely used in ceramic wear-resistant composite plating on metal surfaces. High temperature resistance and thermal shock resistance: Silicon nitride nanoparticles can maintain stability in high temperature environments and have good thermal shock resistance, making them suitable for environments that require high temperature and drastic temperature changes. Corrosion and radiation resistance: Silicon nitride nanoparticles exhibit excellent corrosion and radiation resistance, which makes them very useful in certain special industrial fields. Low friction coefficient: Silicon nitride has a low sliding friction coefficient and can be used to manufacture self-lubricating materials, improving the service life of mechanical components. High thermal conductivity: Silicon nitride has a high thermal conductivity and is suitable for use as a heat dissipation material, especially when the heating power of electronic components increases. Silicon nitride ceramic substrates become an ideal choice.
Application Fields
Wear resistant coating: Silicon nitride nanoparticles can be used for ceramic wear-resistant composite plating on metal surfaces, improving the wear resistance and lifespan of mechanical components. Electronic device heat dissipation material: Due to its high thermal conductivity, silicon nitride is widely used in third-generation semiconductor ceramic substrates for heat dissipation management. Composite material reinforcement agent: Silicon nitride nanoparticles can be added as fillers to polymer matrices, such as polymethyl methacrylate (PMMA), to improve the mechanical and thermal conductivity of composite materials. Adhesive sealing material: Modified silicon nitride nanoparticles can be used to bond sealing grouting materials, improving the mechanical strength and durability of the material. Coating additives: Adding silicon nitride nanoparticles to coatings can significantly improve their wear resistance and solvent resistance.
Related Information
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