via-filling copper paste

Product Name via-filling copper paste Product Overview This product is a high-temperature via-filling copper paste specially used for ceramic circuits, formulated with high-purity spherical copper powder, high-temperature resistant inorganic bonding system and special shaping solvent. It is a non-flowing shaped conductive paste. Customized for the via-filling process of upper and lower through-holes on ceramic substrates, it abandons the formula of traditional flowable paste and has excellent shaping and filling performance, which can accurately fill through-holes of ceramic substrates without overflow or hole collapse defects. The product needs to be sintered and cured at high temperature under nitrogen protection atmosphere. After forming, the conductive via structure is dense and full with high conduction consistency and excellent interlayer adhesion. The finished product can withstand a long-term high-temperature environment of 200°C and supports subsequent electroplating modification. It is a special core conductive material for via interconnection and interlayer conduction of ceramic thick film circuits, suitable for the via-filling process of various high-temperature ceramic electronic devices. Technical Parameter •Paste Characteristics: Non-flowing with excellent shaping performance, specially designed for via-filling process •Construction Method: Steel mesh printing, suitable for upper and lower through-hole filling of ceramic substrates •Curing & Sintering Condition: Nitrogen protection atmosphere, constant temperature at 850°C for 20 minutes •Temperature Resistance After Forming: Long-term operating temperature up to 200°C •Applicable Substrate: Special ceramic substrate •Post-processing Performance: Support electroplating processing •Core Function: Realize accurate filling and vertical interlayer conduction of upper and lower through-holes of ceramic circuits Product Features •Exclusive non-flow shaping formula: The paste is non-flowing and will not flow or bleed randomly during printing and hole filling. It can fill through-holes with precise shaping, completely solving the problems of hole collapse, paste overflow and hole position deviation of traditional pastes, with extremely high filling fullness and regularity of through-holes. •Stable high-temperature sintering performance: Adapt to the long-term sintering process of 850°C under nitrogen protection, no oxidation, voids or delamination occurs during 20-minute constant temperature curing. The filled conductive structure is dense and uniform, which effectively ensures the stability and consistency of interlayer conduction of ceramic circuits and avoids high-temperature conduction failure. •Professional filling construction adaptability: Matches the steel mesh printing process, specially adapted to the upper and lower through-hole filling scenarios of ceramic substrates. It features simple construction operation and high fault tolerance, suitable for mass production through-hole filling processes, and greatly improves the yield of circuits. •Excellent temperature resistance and post-processing performance: The sintered hole-filling structure can withstand long-term high-temperature working conditions of 200°C with excellent high-temperature aging resistance and thermal shock resistance. It has high surface flatness and can be directly used for subsequent processing such as electroplating reinforcement and surface modification to improve the conduction stability and corrosion resistance of through-holes. •High substrate bonding reliability: The formula is deeply optimized for ceramic substrates. After sintering, it is closely bonded to the inner wall of ceramic through-holes with firm adhesion, no cracking, falling off or delamination, which greatly improves the overall structural strength and service life of ceramic circuits. Application Fields This product is a special conductive copper paste for through-hole filling of ceramic circuits, mainly applied to the vertical conduction and interlayer interconnection of upper and lower through-holes of various ceramic substrates. It is widely used in the through-hole filling process of high-temperature ceramic thick film circuit boards, ceramic packaging components, ceramic circuits of high-temperature sensors, industrial high-temperature resistant ceramic control modules, precision ceramic electronic devices, automotive high-temperature ceramic electronic components and other products. Specially designed for ceramic circuit scenarios requiring long-term high-temperature service at 200°C and subsequent electroplating processing, it effectively solves the problems of interlayer insulation and conduction interconnection of ceramic substrates, and is a core special material for through-hole conductive interconnection of high-temperature ceramic electronic circuits. User Guide Storage Environment: Store in a fully sealed, cool, dry, ventilated and dust-free dark environment with a standard storage temperature of 5°C~25°C. Avoid high temperature, direct sunlight and humid •water accumulation environment, and keep away from open fire, heat sources, acid-base and corrosive chemicals. •Storage Requirements: As a non-flowing shaped paste, unopened products shall be completely sealed and stored. Open placement is prohibited to prevent solvent volatilization from causing paste drying, hardening and failure. The unused paste after opening shall be compacted and sealed to isolate air, and can be stored under low-temperature refrigeration. Restore to room temperature and stir gently and evenly before use. Violent stirring that damages the shaped structure is prohibited. •Shelf Life: 6 months for original sealed products stored at room temperature and away from light; low-temperature refrigeration can appropriately extend the storage period. Freezing storage is prohibited to prevent paste structural failure and incapability of construction. •Precautions: Avoid severe vibration, extrusion and inverted stacking during storage and handling to prevent damage to the paste structure. Check the paste state regularly. Do not use the paste if there are abnormalities such as drying, hardening, agglomeration and loss of shaping performance.